Plastic metallization is the process where a metallic layer is deposited on a non-metallic or metallic substrate. This is also known as Physical Vapor Deposition.

Physical Vapor Deposition “PVD” is used for Electromagnetic shielding and is a cost effective way of shielding lighter weight materials or materials with unique geometries.

Electromagnetic shielding is one of the most important measures and must be ensured especially for plastic cases which are increasingly used. Consequently, it is necessary to have a cost-effective metallization process for electronic devises which is also compatible with the environment. Vapor deposition of shielding layers by vacuum technology meets these requirements and is an innovative future-oriented technology.

Vapor Deposition Within the Vacuum Chamber


Vapor Deposition Within the Vacuum Chamber

The layer material is separated to atoms or atom groups (molecule fragments, clusters) in a source. This vapor diffuses in the surrounding vacuum and condenses on the substrate to be coated.

Coating Structures

The metallization by vacuum technology uses the condensation of a metal vapor coating the object. This vapor is generated within a vacuum and diffuses within the vacuum. The standard thickness of the metallic layer is 2.2 micrometers with the possibility of up to 10 microns.

 Vapor Generation

The vapor can be generated in a thermally through heat admission. This is called evaporation of layer material. But condensable particles (atoms, atom groups) can also be generated by pulse transmission during bombardment with high-energy ions, the so-called sputtering.

Coating can either be created:

Chemically: Separation by electroplating Chemical separation from the gaseous phase.

Physically: Thermal spraying, Vacuum Technology, Enameling, and Lamination.

Following Possibilities to Generate Vapors


Indirect method: Heating by heating spiral, heated boats and crucible.

Direct method: Heating the material to be evaporated by current passage induction, arc discharge,electron impact, laser radiation.

Combination of direct and indirect methods: Current passage through crucible material to be evaporated.


Cathodic sputtering: DC gas discharge, the material to be sputtered is connected as cathode; for insulators HF gas discharge.

Ion beam sputtering: Ion bombardment from an ion source.

Uses for Vapor Deposition by Vacuum Technology

Functional Purposes:

  • Anti-friction and anti-wearing
  • Layers scratch resistant layers
  • Barrier layers on packing
  • Material
  • Reflectors for light (VIS, UV, IR)
  • Light grids
  • Heat reflecting layers
  • Architectural glass
  • Electromagnetic shielding
  • Layers and
  • Discharge of electrostatic
  • Charges
  • Optical layers
  • Mirrors, filters, antireflection
  • Function layers for electronics
  • Microelectronics
  • Microsystem
  • Technology

Housing Metallization

Housing Metallization
Housing Metallization
Housing Metallization