Clamshell Gasket
The Clamshell Gasket consists of an aluminum cover with a dispensed conductive silicone (Form-In-Place Gasket) on the edges. This eliminates the potential of RF leakage from substrate deformation and minimizes the number of screws required to maintain full contact with the PCB.
Benefits
- Applicable for both low and high volume applications
- Metal frame can be used to dissipate heat
- Increased board space due to thin wall requirement
Silicone additives available
- Ag/Ni
- Ag/Cu
- Ni/Graphite
Aluminum housing options
- Machined
- Extruded
- Die Cast
Plastic Shield Can | PCan
Pcan uses a molded plastic frame metallized with our proprietary Physical Vapor Deposition process with a conductive silicone edge to eliminate any potential gaps. Pcans are most commonly attached via screws and are an excellent solution for low cost multi-cavity applications.
Plastic Metallization (Physical Vapor Deposition)
- Various metal coating combinations available (Copper / Nichrome coating is standard)
- Excellent adhesion and conformity
- Maximum temperature 70 – 150°C
- ABS, PC, PC/ABS, PA, PPA, PPS
- Use of Glass or Carbon Fillers to adjust rigidity available
- Physical Vapor Deposition Metallization
- Robotic placement for repeatability
- Highly conductive for superior shielding
- Minimum contact width of 0.3mm
- Grounds to PCB
Pressure Formed Plastic Can | PFCan
A thermal formed metallized plastic film, the PFCan is perfect for low cost multi-cavity applications which require an extremely compact form factor. The gasket is typically attached after final testing via a press and can easily be removed for rework.
Benefits
- Layout design flexibility
- Ability to have multiple cavities
- Total height between 0.2mm to 20mm
- Avoid solder temperature exposure
- Easy to install and rework
- Cost effective
- Smaller footprint for space-constrained designs
- Light weight