Conductive Form-In-Place Gasket
Description: F5321 is a room temperature curable version of F5301, which has high mechanical strength, excellent adhesion and is ideal for a small gasket profile requirement.
This material is suitable for metal or glass fabric filled plastic substrates.
The F5321 offers enhanced galvanic corrosion resistance and stability in severe environments.
- Extremely small gasket profile in Ni/Gr filled FIP line.
- More than 100 dB shielding effectiveness from 200MHz to 10GHz with a small gasket bead.
- Accuracy for gasket location within 0.001″ (0.025 mm).
- More than 80Newtons/cm2 shear adhesion on common housing substrates and coatings.