Conductive Form-In-Place Gasket

Description: F5221 is a room temperature curable Ag/Cu filled FIP silicone gasket, which has highly compressible, extremely high conductivity, this material provides superior shielding effectiveness at a much softer compression level.

This material is suitable for metal or glass fabric filled plastic substrates. The F5221 is compatible with various substrates containing enhanced galvanic corrosion resistance and stability in severe environments.


  • Extremely High Conductivity in the Ag/Cu filled FIP line.
  • A highly compressible soft gasket designed for low compression force applications.
  • More than 100 dB shielding effectiveness from 200 MHz to 10GHz with a small gasket bead
  • More than 80 Newtons/cm2 shear adhesion on common housing substrates and coatings.

Technical Information