Clamshell Gasket

Clamshell Gasket
Clamshell Gasket
Clamshell Gasket

The Clamshell Gasket consists of an aluminum cover with a dispensed conductive silicone (Form-In-Place Gasket) on the edges. This eliminates the potential of RF leakage from substrate deformation and minimizes the number of screws required to maintain full contact with the PCB.

Benefits

  • Applicable for both low and high volume applications
  • Metal frame can be used to dissipate heat
  • Increased board space due to thin wall requirement

Silicone additives available

  • Ag/Ni
  • Ag/Cu
  • Ni/Graphite

Aluminum housing options

  • Machined
  • Extruded
  • Die Cast

Plastic Shield Can | PCan

Pcan uses a molded plastic frame metallized with our proprietary Physical Vapor Deposition process with a conductive silicone edge to eliminate any potential gaps. Pcans are most commonly attached via screws and are an excellent solution for low cost multi-cavity applications.

Plastic Shield Can, PCan
Plastic Shield Can, PCan
Plastic Shield Can, PCan

Plastic Metallization (Physical Vapor Deposition)

  • Various metal coating combinations available (Copper / Nichrome coating is standard)
  • Excellent adhesion and conformity
  • Maximum temperature 70 – 150°C
  • ABS, PC, PC/ABS, PA, PPA, PPS
  • Use of Glass or Carbon Fillers to adjust rigidity available
  • Physical Vapor Deposition Metallization

Conductive Silicone Gasket

  • Robotic placement for repeatability
  • Highly conductive for superior shielding
  • Minimum contact width of 0.3mm
  • Grounds to PCB

Pressure Formed Plastic Can | PFCan

Pressure Formed Plastic Can, PFCan
Pressure Formed Plastic Can, PFCan
Pressure Formed Plastic Can, PFCan

A thermal formed metallized plastic film, the PFCan is perfect for low cost multi-cavity applications which require an extremely compact form factor. The gasket is typically attached after final testing via a press and can easily be removed for rework.

Benefits

  • Layout design flexibility
  • Ability to have multiple cavities
  • Total height between 0.2mm to 20mm
  • Avoid solder temperature exposure
  • Easy to install and rework
  • Cost effective
  • Smaller footprint for space-constrained designs
  • Light weight